JPS6234466Y2 - - Google Patents

Info

Publication number
JPS6234466Y2
JPS6234466Y2 JP1981015267U JP1526781U JPS6234466Y2 JP S6234466 Y2 JPS6234466 Y2 JP S6234466Y2 JP 1981015267 U JP1981015267 U JP 1981015267U JP 1526781 U JP1526781 U JP 1526781U JP S6234466 Y2 JPS6234466 Y2 JP S6234466Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
silver
layer
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981015267U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57128159U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981015267U priority Critical patent/JPS6234466Y2/ja
Publication of JPS57128159U publication Critical patent/JPS57128159U/ja
Application granted granted Critical
Publication of JPS6234466Y2 publication Critical patent/JPS6234466Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1981015267U 1981-02-04 1981-02-04 Expired JPS6234466Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981015267U JPS6234466Y2 (en]) 1981-02-04 1981-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981015267U JPS6234466Y2 (en]) 1981-02-04 1981-02-04

Publications (2)

Publication Number Publication Date
JPS57128159U JPS57128159U (en]) 1982-08-10
JPS6234466Y2 true JPS6234466Y2 (en]) 1987-09-02

Family

ID=29813269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981015267U Expired JPS6234466Y2 (en]) 1981-02-04 1981-02-04

Country Status (1)

Country Link
JP (1) JPS6234466Y2 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129465U (en]) * 1976-03-26 1977-10-01
JPS54146960A (en) * 1978-05-10 1979-11-16 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS57128159U (en]) 1982-08-10

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